Heatsink Viscous Plaster Thermal Conductive Adhesive Compound Glue For PC GPU IC

Description

Thermal properties, strong adhesion.
Melting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance: <0.06
Clotting time: 3min (25 degree celsius)
Strength of connected buildings: 25Kg
Insulation coefficient: > 5.1
Dissipation coefficient: <0.005
Temperature resistance: 200 degree celsius
Net Weight: 5g

Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.

Item includes
1x Heatsink Plaster